The process is a manufacturing method that employs particles of abrasive material to remove stock from a surface. It is comparable to sanding or grinding, except that sanding and grinding use abrasives that are fixed (bonded abrasives) whereas professional lapping services employs abrasives that are suspended in a liquid carrier and are free to ...

Simultaneous double side grinding (SDSG) is one of the processes to flatten the wire-sawn wafers. This paper reviews the literature on SDSG of silicon wafers, covering the history, machine development (including machine configuration, drive and support systems, and control system), and process modeling (including grinding marks and wafer shape).

In double-sided grinding, the material removal on the surface of the workpiece is non-uniform. The thermal deformation of the material may be one of the influencing factors. However, it is difficult to predict and measure the temperature field distribution in the workpiece in double-sided grinding. In this paper, based on the grain trajectory model, a single effective …

Double-sided planetary grinding was attempted to put into sapphire substrate lapping. Simulation methods were used to quantify the uniformity of the workpiece surface. The differences of the trajectory distribution on both sides of the workpiece were revealed. High-efficiency precision machining of sapphire can be achieved by this grinding method.

METHOD FOR DOUBLE-SIDED LAPPING WORKPIECE, METHOD FOR PRODUCING WORKPIECE, AND DOUBLE-SIDED LAPPING APPARATUS FOR WORKPIECE According to the present invention, the sum and the ratio of the torque of a sun gear and the torque of a internal gear are controlled to be within predetermined ranges. WO/2021/252540A1

Symmetric double-sided two-way ranging is a well-known technique to deal with clock drift in time-of-flight measurements between unsynchronised devices. However, the requirement for symmetric reply delays is often not feasible. This paper presents an alternative way to process double-sided two-way ranging measurements that eliminates the need ...

Double-sided polishing process is a precise machining method for silicon wafers.It has the characteristics of the multi-directional motion,the complicated load and the tiny material removal.The wafer… Expand 5 An investigation of the effects of the tool path on the removal of material in polishing H. Tam, Haobo Cheng Materials Science 2010

Double-sided planetary grinding as an efficient and precise machining method is used for the rapid thinning and flattening process of sapphire substrate. As an intermediate processing technology of sapphire substrate preparation procedure, many experiments are carried out to evaluate the lapping effect in the paper. Surface quality, processing efficiency, and surface …

Double-sided grinding and polishing, also known as double-sided lapping and polishing is performed with particles suspended in a liquid vehicle to abrade parts equally from both surfaces. The process produces a relatively stress-free environment that induces minimal thermal distortion making it compatible with most optical materials.

The grinding spindle of the KRONOS M is mounted on double-sided bea-rings. The roller-bearing grinding spindle is designed for the use of con-ventional grinding wheels up to 63 m/s. Optionally, spindles for the use of superabrasive cutting materials such as CBN or diamond up to 120 m/s can also be used.

💖【Double-Sided Grit Design】:Coarse grinding and fine grinding combine,which can be easy to handle coarse and fine grinding with only one double-sided diamond sharpening plate.#400 side for coarse grinding,#1000 side for fine grinding.When using,first coarse grinding and then fine grinding for polishing.

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Double Disc Surface Grinding Machine. We designed for high precision grinding of the two paralell surfaces of flat metallic parts such as bearing, valve plate, carbide chip, seal, oil pump vane, piston ring, etc. It can also grind the flat surfaces of non-metallic parts of hard & brittle materials like glass and ceramics.

Abstract. To achieve high surface flatness of silicon wafer in double-sided polishing (DSP) process, kinematical model of DSP process utilizing accurate friction coefficient between wafer and polishing pad was investigated. On the basis of the proposed analytical model, optimization method of a set of rotation conditions of upper/lower platens ...

True to its name, double disk grinding uses two opposing abrasive wheels to grind two sides of a material at the same time. This makes it a very efficient grinding method for achieving a tight tolerance surface finish, flatness, and parallelism in the right applications. Yet there is somewhat of an aura of mystery surrounding double disk grinding.

Double-sided simultaneous grinding method, double-sided simultaneous grinding machine, double-sided simultaneous lapping method, and double-sided simultaneous lapping machine: 2003-11-25: Ikeda et al. 4432245: Grinding machine motor with a torque sensor: 1984-02-21: Hattori et al. 73/862.321

DOI: 10.1016/J.PRECISIONENG.2017.09.001 Corpus ID: 139856592. Study on the double-sided grinding of sapphire substrates with the trajectory method @article{Wang2018StudyOT, title={Study on the double-sided grinding of sapphire substrates with the trajectory method}, author={Lijuan Wang and Zhongwei Hu and Congfu Fang and Yiqing Yu and Xipeng Xu}, …

JP-2000288882-A chemical patent summary.

In theory, the process requires a minimum of three parts. The actual number is determined by part quantity, part size, and machine size. With double-sided lapping and polishing (DSLP), the optical components are held in geared or sprocketed carriers that are driven in a planetary motion covering the full surface of the lapping plates and are subject to continually changing direction …

Diamond wire multi-wire cutting is used to control warp, bow, and TTV; double-sided grinding is used to remove the cutting damage layer and raise warp, bow, TTV and LTV; double-sided polishing is used to reduce the roughness less than 2nm. Chemical mechanical polishing is used to improve the surface quality, make the roughness＜0.2nm and no ...

The double-sided lapping machine is mainly used for double-side lapping of crystals or other mechanical parts that are parallel on two sides, especially the processing of thin brittle materials. It is suitable for various materials of mechanical seal ring, ceramic wafer, cylinder piston ring, oil pump blade bearing end face, silicon, germanium ...

Double-Disc Grinding is a highly efficient grinding method that reduces pre-machining costs up to 50% and provides dimensional tolerances, parallelism, and flatness up to ±.001″. (For even tighter tolerances, see our Surface Grinding process.) Double-Disc Grinding uses two opposing abrasive wheels to simultaneously grind two sides of the ...

Double side grinding is a process with high processing efficiency in which the wheel and the workpiece are in surface contact. But the phenomenon that the workpiece surface profile is out of tolerance exists because of the material removal non-uniformity in the grinding process. In order to improve the surface integrity of the ground workpiece, the mathematical …

Prime silicon wafer is hard and brittle material. Due to its properties, double sided lapping machine with ceramic grinding agent were introduced for machining high quality standard silicon wafers. The main focus is the silicon wafer with high accuracy of flatness; to reduce total thickness variation, waviness and roughness.

A kinematic model was established on the basis of the double-sided planetary grinding movement. The double-sided planetary grinding equipment structure is shown in Fig. 1, which consists mainly of an upper and lower plate as well as the sun wheel that rotates around the respective axis.The workpieces are placed in planetary wheels that are driven by the sun …

Method for simultaneous double-sided grinding of a plurality of semiconductor wafers and semiconductor wafer with excellent flatness CN101277464B (en) 2007-03-30: 2011-05-11: : InFlex network system as well as method for settling stopping machine of work access position register

Crownkyn Superhard GC-2M8470B double-sided grinder can meet the requirements of high precision surface grinding or fine grinding, by removing the excess material on the two surfaces of the parts, can obtain extremely accurate geometric precision and surface finish. Usually, this is the last grinding step in the mechanical production chain to ...

Crownkyn Superhard GC-2M84100B double-sided grinder can meet the requirements of high precision surface grinding or fine grinding, by removing the excess material on the two surfaces of the parts, can obtain extremely accurate geometric precision and surface finish.

Wafer double - sided grinding method Download PDF Info Publication number TWI390617B. TWI390617B TW095125111A TW95125111A TWI390617B TW I390617 B TWI390617 B TW I390617B TW 095125111 A TW095125111 A TW 095125111A TW 95125111 A TW95125111 A TW 95125111A TW I390617 B TWI390617 B TW I390617B Authority TW Taiwan Prior art …

Learn how to use double sided tape as a workholding technique for your CNC Machine.Machine: PRO60120